KA WAIWAI | NA MEA HANA (%) | KUMU HANA | KA WAIWAI AKILA(mg/gKOH) | HANA | HOOLAHA |
HOOLAHA AENT | 75 | >100 | 28-36 | KA WAIWAI ELELE ELELE | HE PILI I NA PALAPALA, INKA A ME KA WAI-BASED COLORANT. |
1. Kōkua ia i ka pale ʻana i ka flocculation a hoʻomaikaʻi i ka paʻa o ka mālama ʻana o nā huahana.
2. Hoʻonui ia i ka nani a me ka ikaika o ke kala.Hoemi ia i ka viscosity.
3. He kōkua ia i ka hoʻomaikaʻi ʻana i ke kūlana waikahe ma muli o ka hui kala.
4. He kūpono loa ia no ka hoʻopuehu ʻana i nā puaʻa inorganic me ka moʻo resin-free.5. E ho'ēmi i ka viscosity o ka wai-hoʻopaʻa paʻa paʻa paʻa loa pono.Hoʻohana ʻia ia i nā uhi wai a me ka ʻaila.
PIGMENT AʻO 3%-10%
PIGMENT ORGANIC 15%-50%
ZINC POWDER 2%-5%
KA WAIWAI | NUI EPOXY (mol/100g) | KAHIKI(mpa.s) | PUNA MOLEKULA(g/mol) | HANA |
HIPERBRANCHED EPOXY RESIN | ≥0.49 | 1000 - 2000 | 3000 - 3500 | KA MAKEMAKE |
PILI KEIA HUAKAI I:
NA PILI OLE OLE
NA PILI ANA I KA PONO NO NA MOKU
NA PALAPALA
NA PILI TERERA
HANA KIVILA
NA MEA PUI
NA PILI KAA
NA MEA PILI NO KA LIQUID
NA MEA HANA NO KA PILI UILA
ʻAʻohe mea VOLATILE.
IKEIA E ME KA HAAHAA HAAHAA, HIGH EPOXY VALUE, HIGH
KA HANA A ME KE KUA MAHELE MAIKAI.
HE ANO RESIN ME KE KAUMANA MOLE KIEKULA.
KA WAIWAI | AHEW | ILIʻI(mpa.s) | PUNA MOLEKULA(g/mol) | HANA |
AGENA HOOLA ME KA HAAHAA | 222 | 50 | 1000 | KĀWAI YELE MAHELE |
HE ANO O KA AGENE CURING NO EPOXY SERIES.
HE KOKUA I KA HOʻOMAʻI I KA TENACITY A ME KA HOʻOPIʻI, A ME KA VISCOSITY ME
NA MEA KUMU.
HE ANO COPOLYMER ME POLYAMINO.MA KE CURING AGENT NO EPOXY SERIES, HE KOKUA I KA HOʻOMAʻI I KA TENACITY A ME KA HOʻOPIʻI, A ME KA VISCOSITY ME NA MATERIAL BASE.
Hiki ke hoʻokomo pololei ʻia i loko o ka FORMULA.HE 0.5%-20% O KA HUI RESIN.
KA WAIWAI | NA MEA HANA (%) | NUI PARTICLE (µm) | KA WAIWAI AKILA(mg/gKOH) | HANA | HOOLAHA |
NA MEA PANUI ANA | 20% | MAX.15 | MAX.5 | KĀWAI YELE MAHELE | HE ANO HE ANO PAPUA A ME KA PALAPALA PAA NO NA PILI PAA KIEKIE. |
Hiki ke loaʻa ka THIXOTROPY VISCOSITY no ka hoʻomaikaʻi ʻana i nā waiwai anti-sediment a me anti-sagging.HE KOKUA I KA HOIKE ANA I KA HUA NO NA HUA METALIKA e like me na pauda gula, na pauda kala a me na pauda alumini.
Hiki ke hoʻokomo pololei ʻia i loko o ka FORMULA.HE 0.5%-20% O KA HUI RESIN.